SkyWater to support the production expansion of their MSeries FOWLP technology,” said Rezwan Lateef, President of YES. “Deca RapidCure technology is an important addition to our curing and materials engineering capabilities, enabling YES to address a wider range of advanced packaging applications, including low temperature polymer curing, underfill baking, adhesive curing, degassingcuring of lowK films, and a variety of new fanin packaging processes. Today’s announcement is the realization of our vision to ultimately provide SkyWater and other leading advanced packaging customers with the broadest range of polymer curing technologies to support the development of nextgeneration products at lower costs and better reliability.”
“We are excited that Rezwan and the YES team are bringing their powerful RapidCure product to market for the semiconductor industry,” said Tim Olson, Founder and CEO of Deca. “RapidCure’s ability to fully cure pakistan phone number list industrystandard polyimide and PBO materials in less than 20 minutes brings unprecedented cycle time reduction breakthroughs for the future of highdensity heterogeneous integration. Deca created the RapidCure process as part of the development of the MSeries FOWLP and FOPLP technologies under the guidance of our legendary Chairman, TJ Rodgers, Founder and CEO of Cypress Semiconductor. RapidCure reduces the typical sixhour cure time by more than 10 times, accelerating the development and production of tomorrow’s advanced chipletbased devices.